Please use this identifier to cite or link to this item: https://hdl.handle.net/20.500.12015/3220
Title: 3D Printing/Digital Fabrication for Education and the Common Good
Authors: Stickel, O.
Aal, K.
Fuchsberger, V.
Rüller, S.
Wenzelmann, V.
Pipek, Volkmar
Wulf, Volker
Tscheligi, Manfred
Lewkowicz, Myriam
Rohde, Markus
Mulder, Ingrid
Schuler, Douglas
Keywords: 3D printing;additive manufacturing;common good;community innovation;digital fabrication;education;maker;making
Issue Date: 2017
Publisher: ACM Press, New York
metadata.dc.relation.ispartof: Proceedings of the 8th International Conference on Communities and Technologies
metadata.mci.reference.pages: 315-318
Abstract: 3D printing has 1 become an area of intense interest in many disciplines ranging from industry through education, humanitarian and innovation contexts to research. At the same time, technologies, materials, usages and appropriation are in constant flux. 3D printing is but one of the many facet of digital fabrication, the digitalization of more sectors, "Industry 4.0" and increasing community-based innovation and (open/commons-oriented) engineering practices. This workshop is intended to illustrate and discuss cases, positions, concepts and experiences related to such developments in digital fabrication, especially in 3D printing. We specifically look for contributions highlighting the role of digital fabrication and 3D printing for the common good and the education sector. This is in line with C&T's socio-technical focus, research suggesting the immense potential in digital fabrication and education as well as growing practices in using digital fabrication/3D printing in humanitarian efforts.
metadata.dc.identifier.doi: 10.1145/3083671.3083708
URI: https://hdl.handle.net/20.500.12015/3220
ISBN: 978-1-4503-4854-6
metadata.mci.conference.sessiontitle: Long Papers
metadata.mci.conference.location: Troyes, France
metadata.mci.conference.date: June 26-30, 2017
Appears in Collections:C&T 2017: Proceedings of the 8th International Conference on Communities and Technologies

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